2002
Vogel, D.; Gollhardt, A.; Michel, B.:
Micro- and nanomaterials characterization
by image correlation methods.
Sensors and Actuators A 3286 (2002), pp. 1-7
Michel, B.; Vogel, D.:
MicroDAC and nanoDAC - Powerful Techniques
for Nondestructive Microcrack Evaluation.
Int. Symp. SPIE, Conf Nondestructive Evaluation of
Micro- and Nanomaterial Systems, San Diego, USA, March
18-20, 2002, proc. p.195
2001
Vogel, D.; Grosser, V.; Schubert, A; Michel, B.:
MicroDAC Strain Measurement for Electronics
Packaging Structures.
Journal of Optics and Lasers in Engineering, 36 (2001),
pp. 195-211
Vogel, D.; Auersperg, J.; Michel, B.:
Characterization of Electronic Packaging Materials
and Components by Image Correlation Methods.
Symp. on Advanced Photonic Sensors and Applications
II, Singapore, Nov 27-30, 2001, Proc. of SPIE, Vol.
4596, pp. 237-247
Vogel, D.; Michel, B.:
Microcrack Evaluation for Electronics Components
by AFM nanoDAC Deformation Measurement.
IEEE-NANO 2001, Maui, USA, Oct. 28-30, 2001, proc.
pp. 309-312
Vogel, D.; Gollhardt, A.; Walter, H.; Dudek, R.; Kühnert,
R.; Michel, B.:
mTest - A new Approach to Measure Material
Properties from Microscopic Specimens.
Int. Conf. POLYTRONIC 2001, Potsdam, Oct. 21-24, 2001,
proc.
2000
Vogel, D.; Wittler, O.; Michel, B.:
Experimental Methods in the Mechanical Characterization
of Polymers and its Relation to Finite Element Simulation
(invited).
IEEE-CPMT/IMAPS-UK/IEEE-CPMT Workshop POLY 2000, Polymeric
Materials for Microelectronics & Photonics Applications:
Mechanics, Physics, Reliability, Processing, London,
UK, Dec. 4-5, 2000, proc.
Wittler, O.; Walter, H.; Gollhardt, A.; Vogel, D.;
Sprafke, P.; Michel, B.:
Time and Temperature Dependent Mechanical
Characterization of Polymers for Microsystems Applications.
Materials Week 2000, München, Sept. 25-28, 2000
Vogel, D.; Kaulfersch, E.; Simon, J.; Kühnert, R.;
Schubert, A.; Michel, B.:
Measurement of Thermally Induced Strains on
Flip Chip and Chip Scale Packages.
Proc. of ITherm 2000, Las Vegas, USA, 2000, May 23-26,
pp. 232-239
Vogel, D.; Gollhardt, A.; Schubert, A.; Kühnert, R.;
Michel, B.:
microDAC Strain Measurement for FEA Support.
3rd Int. Conf. MicroMat2000, Berlin, April 17-19.
2000, proc.
Vogel, D. ; Luczak, F.; Wittler, O.; Gollhardt, A.;
Walter, H.; Michel, B.:
Measurement of Material Properties by a Modified
microDAC approach.
3rd Int. Conf. MicroMat2000, Berlin, April 17-19.
2000, proc., pp. 829-832
Vogel, D.; J. Chen, de Wolf, I.:
Experimental validation of finite element
modeling.
Benefiting from Thermal and Mechanical Simulations
in Micro-Electronics, ed. G.Q. Zhang, Kluwer
Academic Publ., Boston, 2000, pp. 113-133
