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Staff
Prof. Dr. rer. nat. habil. Bernd Michel (Director
of Micro Materials Center Berlin)
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studied
physics, Ph.D. in Solid State Physics at Martin-Luther-University
Halle-Wittenberg in 1976. Professor for Solid Mechanics
at the Institute of Mechanics of Academy of Sciences
Berlin and Chemnitz from 1982. 1993 till now Head
of Department Mechanics Reliability and Micro Materials
of Fraunhofer Institute IZM, Berlin and Head of
Dept. Simulation and Design of Microsystems at the
Technical University Berlin. Since 2000 Director
of Micro
Materials Center Berlin. He deals with micro-
and nanoreliability concepts, fracture mechanics
for microcomponents. General Chair of International
Micro Materials Conferences.
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Dr.
rer. nat. Dietmar Vogel (Head of NanoMechanics Lab)
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studied
physics and received Ph.D. in plasma physics from
St. Petersburg State University in 1980. 1981-1991
with the Institute of Mechanics, Chemnitz. 1993
he joined Fraunhofer IZM, Berlin, Dept. of Mechanical
Reliability and Micro Materials. Main experience
in experimental micro mechanics and related measurement
techniques of electronic packaging. He deals with
new approaches for deformation measurement techniques
(microDAC) on micro and nano structures. Head of
the Fraunhofer Nanomechanics Lab Berlin Adlershof
within the MMCB. Member of IEEE.
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Astrid
Gollhardt
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education
of physics technical engineer in Stuttgart in 1989.
From 1989 to 1993, staff member at the Department
von Klitzing, Max Planck Institute of Solid State
Research, Stuttgart. Since 1997 with Fraunhofer
IZM, Berlin, at the Department of Mechanical Reliability
and Micro Materials. Main field of activity on scanning
electron microscopy (SEM), in-situ mechanical- and
heating measurement in SEM and AFM, and microDAC
deformation measurements in packaging.
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Dipl.-Ing.
Jürgen Keller
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finished
his study of Mechanical Engineering at the University
of Kaiserslautern in 1999. Since then he is pursuing
the Ph.D degree in a collaboration of the Lehstuhl
Polymermaterialien at the Brandenburgische Universität
Cottbus and the Fraunhofer Institute for Reliability
and Micro Integration, Berlin.
Research topics:
Development and application of the nanoDAC technique
for Crack evaluation of thermoset polymers.
Thermomechanical reliability assessment of MEMS
and NEMS.
Microstructral analysis with SPM methods.
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